Applications
Serviceable Application of SurfCon®
by Type of End Effector
- Replace Conventional Elastomer Pads with SurfCon®
- Attach SurfCon® on Pocket Hold Type End Effector
- Replace Vacuum Suction Pad with SurfCon®
- Attach SurfCon® on Edge Grip Type End Effector
- Replace Bernoulli Pad with SurfCon®
by Type of Chronic Issues
- Substrate sliding and misalignment
- Popping during pick and place
- Low throughput
- Backside contamination
- Short lifetime of conventional elastomer pads
- Electrostatic Discharge
- High temperature (~300℃)
- Different handling methods for ATM vs. VTM
by Type of Substrate
- Normal Si Wafer
- TAIKO Wafer
- Warped Wafer
- Glass Wafer
- Sapphire Wafer
- LT Wafer
- SiC Wafer
- Ultra Thin Wafer
- Ring Framed Wafer
- Display Glass
- Photovoltaic Cell
Blade Type | Environment | Temp | Chronic Issues of Conventional Handling Method |
---|---|---|---|
Vacuum Suction with Elastomer Pad | ATM | Room Temp | Backside mark, Sliding, and High Cost |
Pocket Type | ATM | Room Temp | Natural sliding and Collision, Chipping and Particles |
Edge Grip | ATM | Room Temp | Substrate damage by strong grip, Chipping and Particles |
Passive (Elastomer Pad) |
ATM | Room Temp | Easy Worn-out, Wafer Misalignment and Sliding by Weak Adhesion Force, Short Lifetime (3~4 months), Particles, Not able to use at ~300 degree C |
Pocket Type | Vacuum | Room Temp | Natural sliding and Collision, Chipping and Particles |
Passive (Elastomer Pad) |
Vacuum | Room Temp | Easy Worn-out, Wafer Misalignment and Sliding by Weak Adhesion Force, Short Lifetime (3~4 months), Particles, Not able to use at ~300 degree C |
Pocket Type (Ceramic) |
ATM | High Temp | Natural sliding and Collision, Chipping and Particles |
Pocket Type (Ceramic) |
Vacuum | High Temp | Natural sliding and Collision, Chipping and Particles |
Example of SurfCon® for Substrate Handling
SurfCon® on ATM Robot End Effector
SurfCon® on Passive Type End Effector
SurfCon® on VTM Robot End Effector