Serviceable Application of SurfCon®

by Type of End Effector

- Replace Conventional Elastomer Pads with SurfCon®

- Attach SurfCon® on Pocket Hold Type End Effector

- Replace Vacuum Suction Pad with SurfCon®

- Attach SurfCon® on Edge Grip Type End Effector

- Replace Bernoulli Pad with SurfCon®

by Type of Chronic Issues

- Substrate sliding and misalignment

- Popping during pick and place

- Low throughput

- Backside contamination

- Short lifetime of conventional elastomer pads

- Electrostatic Discharge

- High temperature (~300℃)

- Different handling methods for ATM vs. VTM

by Type of Substrate

- Normal Si Wafer

- TAIKO Wafer

- Warped Wafer

- Glass Wafer

- Sapphire Wafer

- LT Wafer

- SiC Wafer

- Ultra Thin Wafer

- Ring Framed Wafer

- Display Glass

- Photovoltaic Cell

Blade Type Environment Temp Chronic Issues of Conventional Handling Method
Vacuum Suction with Elastomer Pad ATM Room Temp Backside mark, Sliding, and High Cost
Pocket Type ATM Room Temp Natural sliding and Collision, Chipping and Particles
Edge Grip ATM Room Temp Substrate damage by strong grip, Chipping and Particles
Passive
(Elastomer Pad)
ATM Room Temp Easy Worn-out, Wafer Misalignment and Sliding by Weak Adhesion Force, Short Lifetime (3~4 months), Particles, Not able to use at ~300 degree C
Pocket Type Vacuum Room Temp Natural sliding and Collision, Chipping and Particles
Passive
(Elastomer Pad)
Vacuum Room Temp Easy Worn-out, Wafer Misalignment and Sliding by Weak Adhesion Force, Short Lifetime (3~4 months), Particles, Not able to use at ~300 degree C
Pocket Type
(Ceramic)
ATM High Temp Natural sliding and Collision, Chipping and Particles
Pocket Type
(Ceramic)
Vacuum High Temp Natural sliding and Collision, Chipping and Particles

Example of SurfCon® for Substrate Handling

How to use SurfCon® on current method

Conventional Style End Effector

Immediate Field Replacement by SurfCon®