• Innovative Dry Adhesive Non-Slip Pad
    Transform the future of innovative handling solution
    with advanced polymer synthesis engineering
    and specialized surface-patterning technology.

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Latest News

2021.02.03

NEPCON JAPAN 2021

Asia's Leading Exhibition for Electronics R&D, Manufacturing and Packaging TechnologyLaunched more than 30 years ago, NEPCON JAPAN has grown together with the Japanese & Asian electronics industry. Consisting of 6 shows specialised in essential areas for electronics manufacturing and R&D, the show has increased its value as an exhibition representing Asia's leading one-stop venue for all those involved in electronics industry. We participated in NEPCON 2021 with our sales representative NTE this year !!

2020.10.16

High-functional Material Expo 2020 (高機能素材Week 2020 OSAKA,JAPAN)

Glint Material exhibited our SurfCon with our sales representative from Oct 7th~Oct 9th,2020. Highly-functional Material Week is a world's leading materials show consisting of 6 specialized fairs for advanced film, plastics, metal, ceramics, joining and coating technologies. The show gathers a wide range of highly-functional materials and processing equipment, testing/analysis equipment, recycling technologies, etc. It is held twice a year in Osaka and Tokyo.

2020.09.28

SEMICON TAIWAN 2020

Join Glint Materials at SEMICON Taiwan 2020 to embrace innovative changes driven by the Fourth Industrial Revolution. We are pleased to be exhibiting in booth# I2512 1th floor of our sales partner Nagase Taiwan Co.,Ltd