ADHESIVE01
Adhesive Type
Pads attached to the end effector using an adhesive backing.
For attachment to an existing contact surface.
Request adhesive-type samplesSURFCON® / PRODUCT SELECTION
Start with the installation method.
Then select the material and contact geometry
for your wafer handling requirements.
Choose how SurfCon® integrates with your end effector.
Pads attached to the end effector using an adhesive backing.
For attachment to an existing contact surface.
Request adhesive-type samples →Pads mechanically installed into a matching end-effector hole.
Match pad geometry to the mounting hole.
Request insert-type samples →Bonded pad configurations for application-specific integration.
Discuss the interface and assembly requirements.
Discuss a bonded configuration →Consider the wafer warpage and required contact area. Dome geometry can accommodate concave and convex wafers; flat pads require sufficient height relative to the warpage. Confirm the geometry through application evaluation.
SurfCon® DONUT and vacuum cup configurations are available for applications that require vacuum suction. Discuss the suction interface and wafer contact conditions with our team.
Model, dimensions and material are selected together. Custom designs available.
MATERIAL SELECTION
Start with the electrical requirement, then review the contact surface, temperature and process environment together.
02 / MATERIAL
Proprietary polymer for SurfCon® pads, designed for purity and chemical resistance.
For applications without an ESD conductivity requirement.
Discuss POLMA® →
Proprietary conductive polymer for wafer handling applications with ESD requirements.
Select conductivity specifications for your process.
Discuss CONEPOL® →Wafer size · Backside finish · Warpage · Temperature · ESD requirements · Mounting dimensions
SURFCON® / PRODUCT EXAMPLES
Browse examples by installation method. Final dimensions, material and contact geometry are selected for your substrate and process.
DIRECT ATTACHMENT
For attachment to a suitable end-effector contact surface. Review the backing and interface for your operating conditions.
MECHANICAL FIT
For a matching end-effector mounting feature. Pad and mounting-hole dimensions are reviewed together.
Product examples illustrate configurations, not a fixed specification. Grip, tack, thermal compatibility and electrical properties depend on the selected model and operating conditions.
CUSTOM CONFIGURATIONS
Share the substrate, mounting interface and available space. We can review a suitable pad configuration and the next evaluation step.