Glint Materials® pioneers bio-inspired dry adhesives engineered for precise substrate handling in the semiconductor industry. Dedicated to driving customer success, we invite you to share your wafer handling challenges with us. Let’s partner to find the perfect solution.
Our Core Value

Harmony
No Blame, No Discrimination, No Factions
Empathy in Action / Perspective-Taking

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Expertise
Deep Domain Knowledge, Professionalism
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Continuous Improvement
Self-Development
Process Optimization / Work Improvement
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History
2018~2020
Established Glint Materials Co., Ltd.
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2020~2022
Development of Bio-Inspired Dry Adhesive Pad for Semiconductor Wafer Handling
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2023~2025
Mass production for global major semiconductor equipment makers and working with over 150 customers in worldwide