Polymer engineering
Proprietary material options for the contact surface, operating temperature and electrical requirements.
ABOUT GLINT MATERIALS
Glint Materials develops bio-inspired dry adhesive pads for semiconductor wafer and precision substrate handling.
We bring together proprietary polymers, engineered microstructures and application-specific pad designs to address the interface between your substrate and handling equipment.
From surface science to practical handling solutions.
OUR EXPERTISE
We consider the material, surface structure and equipment interface together to develop pads around the handling task.
Explore surface engineering ↗Proprietary material options for the contact surface, operating temperature and electrical requirements.
Engineered contact features that balance grip during transfer with controlled release during lift-off.
Pad shape, mounting and placement considered alongside the substrate and end-effector design.
See how these capabilities come together in SurfCon®.
Explore our pads ↗COLLABORATION & RECOGNITION
Selected records of research collaboration, technical achievement and social contribution.
OUR CORE VALUES
Our work is guided by collaboration, technical expertise and continuous improvement.
Work with respect and empathy. Understand different perspectives and solve problems together without blame or discrimination.
Build deep domain knowledge and apply professional judgment to the materials, interfaces and processes we develop.
Keep learning, refine our processes and improve the way we work to better support our customers.
OUR JOURNEY
Established Glint Materials Co., Ltd.
Developed bio-inspired dry adhesive pads for semiconductor wafer handling.
Entered mass production for semiconductor equipment applications and expanded support for customers worldwide.
WORK WITH GLINT MATERIALS
Share your substrate and process conditions. We will review the pad requirements and discuss the next evaluation step with you.