Glint Materials® pioneers bio-inspired dry adhesives engineered for precise substrate handling in the semiconductor industry. Dedicated to driving customer success, we invite you to share your wafer handling challenges with us. Let’s partner to find the perfect solution.
Our Core Value

Harmony
No Blame, No Discrimination, No Factions
Empathy in Action / Perspective-Taking


Expertise
Deep Domain Knowledge, Professionalism

Continuous Improvement
Self-Development
Process Optimization / Work Improvement


History
2018~2020
Established Glint Materials Co., Ltd.

2020~2022
Development of Bio-Inspired Dry Adhesive Pad for Semiconductor Wafer Handling

2023~2025
Mass production for global major semiconductor equipment makers and working with over 150 customers in worldwide