SurfCon® Bio-Inspired Innovative Non-Slip Pad for Semiconductor Wafer Handling
Glint Materials has been the first pioneering company developing and manufacturing bio-inspired dry adhesive pads especially for semiconductor industry that requires precise substrate handling. Our top priority is to contribute customers' success and continuose improvement. Please feel free to contact us with your problems over semiconductor wafer handling. We will do our best to resolve your problems.
AWARD
Recognition of Social Contribution
By Red Cross
AWARD
Medal of Social Contribution
By Red Cross
CERTIFICATIONS
Technical Achievement
By Korea Technology Finance Corporation
R&D Collaboration
Industry-University Institute Collaboration
Collaboration with University
What we believe
Innovation
If you don't innovate every day, you fall behind.
We are constantly trying to come up with innovative and creative ways to solve customers' problems.
Quality
There is absolutely no such thing as "moderate" or "compromising" when it comes to quality.
It is the part that management puts the most effort into and continues to invest in maintaining and improving quality.
Teamwork
There are not many things you can do on your own.
Beyond teamwork among internal members of the organization, we are trying to create synergy by creating teamwork with customers.
History
2018~2020
Established Glint Materials Co., Ltd.
2020~2022
Development of Bio-Inspired Dry Adhesive Pad for Semiconductor Wafer Handling
2023~2025
Mass production for global major semiconductor equipment makers and working with over 120 customers in worldwide