Adhesive type
A pad with an adhesive backing for direct attachment to the end effector.
DIRECT ATTACHMENT
BIO-INSPIRED. PRECISION-ENGINEERED.
SurfCon® bio-inspired dry adhesive pads.
Engineered for stable wafer handling
with high lateral grip and low vertical tack.
From proprietary polymers to precision microstructures.
Stability during wafer transfer.
Controlled, smooth wafer release.
Designed around your application.
01 / SURFCON® PRODUCTS
Dry adhesive pads for the contact point between your substrate and handling equipment. Choose a mounting approach, then match the material and geometry to your process.
Explore pad configurations ↗A pad with an adhesive backing for direct attachment to the end effector.
A mechanically fitted pad for integration with a matching mounting feature.
A pad bonded to a supporting component for your specified interface.
POLMA® Insulative polymer / CONEPOL® Conductive polymer
Select to match your process and ESD needs.02 / SURFACE ENGINEERING
Inspired by gecko adhesion. Refined for precision wafer handling.
Understand the technology ↗Proprietary polymers selected for the contact surface, temperature and electrical requirements.
Engineered contact features balance lateral grip with low vertical tack.
Pad shape, mounting and placement are considered together with your handling conditions.
Performance depends on the selected model, contact surface and operating conditions.
03 / APPLICATIONS
From stable transfer to controlled lift-off, the right pad starts with a clear understanding of your substrate and process.
Explore handling applications ↗Support stable positioning during wafer movement and acceleration.
Consider pad geometry and placement for warped or uneven substrates.
Review pad and vacuum interface options for the equipment setup.
APPLICATION REVIEW
Share your substrate, process conditions and drawings. Our team will review a suitable pad configuration and the next evaluation step.
GLINT MATERIALS Bio-inspired materials. Precision surface engineering.
Meet the company ↗