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SurfCon®
Bio-Inspired  Dry Adhesive Non-Slip Pad
Strong Lateral Friction
No Stickiness
Contamination Free
Fit for High Temp. and High Vacuum
Electrically Conductive Available
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Innovative Dry Adhesive Non-Slip Pad
Preventing Wafer Sliding​‌
Bio-Inspired Technology​‌

Advanced Polymer Engineering
Micro Scale Structuring
Presicion Surface Modification